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            Location:: Home- Product center- Selective wave soldering -置標出錯:關鍵字 'and' 附近有語法錯誤。
            Selective Welding SUNFLOW FS
            Product features:

            Working principle: After PCB is conveyed to the specified position by the roller and fixed; the soldering platform which is integrated spray function will selectively sprays PCBs according to the setup program, and then drives the electromagnetic pump to move to the specified position.

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            • Product parameters
            • Product details

            Working principle:

            After PCB is conveyed to the specified position by the roller and fixed; the soldering platform which is integrated spray function will selectively sprays PCBs according to the setup program, and then drives the electromagnetic pump to move to the specified position.


            Standard Configuration

            Soldering monitor system

            Teaching programming CCD

            Conveying direction: left → right

            Soldering nozzle: single nozzle

            Spray nozzle: jet fluxer 


            Main Technical specifications

            機體參數

            General technical data

            Max PCB size (mm)

            300(L)x400(W)

            Min PCB size (mm)

            120(L)x50(W)

            PCB top side clearance (mm)

            120

            PCB bottom side clearance (mm)

            30

            PCB technics side (mm)

            ≥3

            Conveyor height from floor (mm)

            850±25

            PCB conveying speed (m/min)

            0.2-10

            PCB weight (kg)

            ≤5

            PCB thickness (include fixture) (mm)

            1-6

            Conveying belt width adjustment (mm)

            50-400

            Conveying belt width adjustment mode

            電動/Power driven

            PCB Conveying direction

            左向右/Left to right

            Compressed air required pressure (Mpa)

            0.5-0.8

            Main voltage(VAC)

            380

            Voltage tolerance range (%)

            6-10

            Frequency (HZ)

            50/60

            Max power consumption (kw)

            <9

            Max current (A)

            <20

            Environment temperature (℃)

            10-35

            Machine noise level(dB)

            <65

            Communication interface

            SMEMA

            Machine dimension(mm)

            1350(L)*1620(W)*1700(H)

            Machine weight(kg)

            800

            Min nozzle outer diameter (mm)

            5.5

            Inner diameter of nozzle (mm)

            2.5-10

            Max solder wave height (mm)

            5

            Solder capacity (kg)

            approx. 13

            Max solder temperature (℃)

            330

            Soldering heating power (kw)

            1.15

            Nitrogen supply

            由客戶提供/Customer prepare

            Max.input pressure (Mpa)

            0.6

            Nitrogen consumption (m3/h)

            1.5

            Nitrogen purity (%)

            ﹥99.999

            噴霧系統

              Spray module

            Spray height(mm)

            60

            Spray speed(mm/s)

            ≤200

            Spray nozzle automatic cleaning function

            程序控制/Program control

            Flux capacity(L)

            2


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